发明名称 VIBRATION DEVICE AND MANUFACTURING METHOD OF VIBRATION DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a vibration device which distributes to a request for downsizing, miniaturization, and commercial production, and has high reliability of oscillation frequency, and like. <P>SOLUTION: A vibration device of the present invention includes: a package on which a vibration piece is mounted; a lid body which houses the vibration piece in a cavity; an adhesion layer which has a first melting point and bonds the package and the lid body; and a metal layer which has a second melting point higher than the first melting point and covers the package, adhesion layer, and lid body. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013046167(A) 申请公布日期 2013.03.04
申请号 JP20110181802 申请日期 2011.08.23
申请人 SEIKO EPSON CORP 发明人 OTSUKI TETSUYA
分类号 H03H3/02;H01L23/02;H03H9/02;H03H9/10 主分类号 H03H3/02
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