| 摘要 |
<p>The soln. comprises a source of Cu ions, a complexing agent (Rochelle salt), reducing agent (formaldhyde), and a stabiliser in the form of small atms. of o-phenanthroline and Na/K iodides (pref. at 0.0001-0.01 gpl), used at pH 10-14, and 15-32 degrees C to effect plating on catalytic metal surfaces or activated synthetic substrates. Used for depositing conducting copper paths in intergrated circuit mfr, the soln. is stable over extended periods.</p> |
