发明名称 HOLE FORMING METHOD AND LASER BEAM PROCESSING APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide a hole forming method and a laser beam processing apparatus, which can form a processed hole to a processed object with which a first material and a second material are connected. <P>SOLUTION: There are provided a minimum-number-of-shots setting process where the number of shots until a spectrum of plasma generated by laser beam irradiation changes from a first material to a second material is set as a minimum value and a maximum-number-of-shots setting process where the number of shots until it completely changes from the first material to the second material is set as a maximum value. In the case that the number of shots reaches the minimum value and the spectrum of the plasma changes from the first material to the second material in forming the laser processed hole, pulse laser beam irradiation is stopped; and in the case that the spectrum of the plasma does not change from the first material to the second material even if the number of shots reaches the minimum value, pulse laser beam irradiation is continued until the number of shots reaches the maximum value and then stopped. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013043198(A) 申请公布日期 2013.03.04
申请号 JP20110182358 申请日期 2011.08.24
申请人 DISCO CORP 发明人 MORIKAZU YOJI
分类号 B23K26/38;B23K26/00;B23K26/40;H01L21/3205;H01L21/768;H01L23/522 主分类号 B23K26/38
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