| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a housing which enables the downsizing and also enables components to be easily mounted and electrically connected with each other. <P>SOLUTION: A housing 1 includes: a first housing 2 having a base part 2a where a height of a surrounding region of a mounting region 27, in which electronic components are mounted, is equal to or lower than a height of the mounting region 27 and surfaces of lead frames 4a and 4b disposed thereon are exposed, and a covering part 2b where the surfaces of the lead frames 4a and 4b are partially covered; and a second housing 3 formed according to the shape of the first housing 2 and has a welded part 36 welded to the first housing 2. <P>COPYRIGHT: (C)2013,JPO&INPIT |
