| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a coreless multilayer wiring board which is capable of improving adhesive strength with a metal layer which forms a circuit even on a smooth resin surface and in which warpage occurrence is reduced, and to provide a coreless multilayer wiring board. <P>SOLUTION: A manufacturing method of a coreless multilayer wiring board includes: a core substrate manufacturing step; a lamination step of bonding an insulating resin layer of an insulating film composed of an adhesion layer A<SP POS="POST">1</SP>and an insulating resin layer onto both adhesion layers X of a core substrate, and performing curing processing to laminate the insulating film; a circuit formation step of forming circuits on respective surfaces by a semi-additive method; a lamination step of bonding an insulating film composed of an adhesion layer A<SP POS="POST">2</SP>and an insulating resin layer to each adhesion layer A<SP POS="POST">1</SP>, and performing curing processing to laminate the insulating film; a via hole formation step of forming a via hole on each adhesion layer A<SP POS="POST">2</SP>; and a circuit formation step of simultaneously or sequentially forming circuits on each adhesion layer A<SP POS="POST">2</SP>by the semi-additive method. After the above steps, this manufacturing method further includes a via hole formation step of peeling a copper foil of the core substrate from the adhesion layer X and forming a via hole on the adhesion layer X after peeling the copper foil, and a circuit formation step of forming circuits on the adhesion layer X by the semi-additive method. There is also provided a coreless multilayer wiring board. <P>COPYRIGHT: (C)2013,JPO&INPIT |
