发明名称 SURFACE ACOUSTIC WAVE DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a surface acoustic wave device which can ensure desired frequency characteristics by making the inductance component adjustable easily without causing increase in cost or development period or deterioration of the characteristics. <P>SOLUTION: The surface acoustic wave device is provided with, in a package 2, a plurality of package side GND electrodes 21, 22, and 23 connectable with a GND electrode 11 of an SAW chip 1 and disposed so that the line lengths from an interdigital electrode 19 are different, and a plurality of package side GND electrodes 24, 25, and 26 connectable with a GND electrode 12 of the SAW chip 1 and disposed so that the line lengths from an interdigital electrode 18 are different. The GND electrodes 11 and 12 of the SAW chip 1 and one or a plurality of corresponding package side GND electrodes are connected by flip-chip bonding so that the inductance between a parallel resonator and a ground level has a desired value. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013046084(A) 申请公布日期 2013.03.04
申请号 JP20110180177 申请日期 2011.08.22
申请人 NIPPON DEMPA KOGYO CO LTD 发明人 KAWAMOTO TOSHIHIKO
分类号 H03H9/145;H03H3/08 主分类号 H03H9/145
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