| 摘要 |
<P>PROBLEM TO BE SOLVED: To easily and reliably remove dust adhered to a solid state image sensor. <P>SOLUTION: The manufacturing method of the imaging device at least comprises: an application process 1 in which a solution for forming an adhesive sheet is applied to a top surface of a solid state image sensor; and a peeling process in which the adhesive sheet is peeled off by a force applied in a direction for peeling off the adhesive sheet formed in the application process 1. <P>COPYRIGHT: (C)2013,JPO&INPIT |
