摘要 |
<p>The device has stages (N1-Nk) superimposed for forming a pile, where one of the stages is made of a variable resistance memory element (C1) including a variable resistivity material area (118). The area is interposed between two electrodes (112, 121). The element includes an interrupt transistor (T1) e.g. vertical channel junction gate FET, including a semiconductor structure (132) that forms a channel. The element and the transistor are connected in parallel between each other via a conducting line (L1) on which the element and transistor are positioned, and another conducting line (L2). The memory element is a resistive RAM (RRAM). An independent claim is also included for a method for realizing a microelectronic memory device.</p> |