| 摘要 |
<p>The present invention enables the sequential cutting, chamfering, and grinding of both side surfaces of a silicon ingot in order to achieve the objectives of improving the workability of the ingot and rationalizing the processing degree and processing time of the ingot in order to easily maintain a certain level of quality. The multi-tasking machine for a silicon ingot according to the present invention cuts and grinds a silicon ingot, and comprises: an aligning apparatus, installed on one side of a mainframe, for aligning a silicon ingot; an auto-loading apparatus for grasping and moving the silicon ingot aligned by the aligning apparatus; a clamping apparatus, installed in the top central portion of the mainframe, for grasping the silicon ingot moved by the auto-loading apparatus, moving the ingot in the lengthwise direction of the mainframe, and then rotating the silicon ingot; a pair of cutting apparatuses, respectively installed at both sides of the mainframe with respect to the center thereof, for cutting both side surfaces of the silicon ingot moved and rotated by the clamping apparatus; and two pairs of grinding apparatuses, installed apart from the rear of the cutting apparatuses and in sequence on both sides at the upper rear of the mainframe, respectively, for grinding both side surfaces of the silicon ingot moved and rotated by the clamping apparatus and cut by the cutting apparatuses.</p> |
