发明名称 |
HEAT DISSIPATION DEVICE INCORPORATING HEAT SPREADER |
摘要 |
An exemplary heat dissipation device is adapted for dissipating heat generated by an electronic component mounted on a printed circuit board. The heat dissipation device includes a heat spreader and a fin set placed on the heat spreader. The heat spreader includes a base, a partition board hermetically placed on the base, and a covering plate hermetically placed on the partition board. A first chamber is defined between the base and the partition board, and a second chamber is defined between the partition board and the covering plate.
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申请公布号 |
US2013048251(A1) |
申请公布日期 |
2013.02.28 |
申请号 |
US201113227460 |
申请日期 |
2011.09.07 |
申请人 |
XIAO JUN;LI MIN;FU MENG;CHEN CHUN-CHI;FOXCONN TECHNOLOGY CO., LTD.;FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD. |
发明人 |
XIAO JUN;LI MIN;FU MENG;CHEN CHUN-CHI |
分类号 |
F28D15/04 |
主分类号 |
F28D15/04 |
代理机构 |
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代理人 |
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