发明名称 COMPRESSION MOLDING METHOD AND DEVICE FOR LIGHT-EMITTING DEVICE REFLECTOR
摘要 Provided are a compression molding method and device for light-emitting device reflectors for which mold resin utilization rate is improved and molding quality is improved such that resin flash does not occur. The reflector (3) is compression molded by: supplying molding resin (26) into recessed cavities (16), in which a release film (21) is held by adsorption, and filling the resin around pressing pins (17); aligning a workpiece with the recessed cavities (16) and placing the workpiece in contact with a clamper block (14) and the pressing pins (17) through the release film (21); clamping the workpiece using the mold (8); and moving the bottoms of the recessed cavities (16) relative to the workpiece to bring same closer to the workpiece by further clamping of the workpiece.
申请公布号 WO2013027601(A1) 申请公布日期 2013.02.28
申请号 WO2012JP70368 申请日期 2012.08.09
申请人 APIC YAMADA CORPORATION;IKEDA, MASANOBU;NAKAYAMA, HIDEO 发明人 IKEDA, MASANOBU;NAKAYAMA, HIDEO
分类号 B29C43/18;B29C43/36;B29C43/56;B29C43/58;B29K63/00;H01L33/60 主分类号 B29C43/18
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