| 发明名称 |
Apparatus and Methods for Annealing Wafers |
| 摘要 |
A method includes performing an anneal on a wafer. The wafer includes a wafer-edge region, and an inner region encircled by the wafer-edge region. During the anneal, a first power applied on a portion of the wafer-edge region is at least lower than a second power for annealing the inner region. |
| 申请公布号 |
US2013052837(A1) |
申请公布日期 |
2013.02.28 |
| 申请号 |
US201113215909 |
申请日期 |
2011.08.23 |
| 申请人 |
WANG YI-CHAO;LIN YU-CHANG;WANG LI-TING;HUANG TAI-CHUN;JENG PEI-REN;LEE TZE-LIANG;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
WANG YI-CHAO;LIN YU-CHANG;WANG LI-TING;HUANG TAI-CHUN;JENG PEI-REN;LEE TZE-LIANG |
| 分类号 |
H01L21/268;B23K26/00 |
主分类号 |
H01L21/268 |
| 代理机构 |
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| 主权项 |
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