| 摘要 |
An integrated circuit package includes a first memory die having a first set of connections, a second memory die arranged adjacent to the first memory die, the second memory die having a second set of connections, a first substrate having a first opening and a second opening, the first substrate having a third set of connections to connect to the first set of connections of the first memory die via the first opening and a fourth set of connections to connect to the second set of connections of the second memory die via the second opening, and a second substrate having a first integrated circuit disposed thereon. The first substrate is connected to the second substrate with the first integrated circuit disposed between the first substrate and second substrate.
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