发明名称 |
3D INTEGRATED CIRCUIT STACK-WIDE SYNCHRONIZATION CIRCUIT |
摘要 |
There is provided a synchronization circuit for a 3D chip stack having multiple circuits and multiple strata interconnected using a first and a second stack-wide broadcast connection chain. The synchronization circuit includes the following, on each stratum. A synchronizer connected to the first connection chain receives an asynchronous signal therefrom and performs a synchronization to provide a synchronous signal. A driver is connected to the second chain for driving the synchronous signal. A latch connected to the second chain receives the synchronous signal driven by the driver on a same or different stratum within a next clock cycle from the synchronization to provide the stack-wide synchronous signal to a circuit on a same stratum. An output of a single driver on one stratum is selected at any given time for use by the latch on all strata. |
申请公布号 |
US2013049825(A1) |
申请公布日期 |
2013.02.28 |
申请号 |
US201113217767 |
申请日期 |
2011.08.25 |
申请人 |
SILBERMAN JOEL A.;WORDEMAN MATTHEW R.;INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
SILBERMAN JOEL A.;WORDEMAN MATTHEW R. |
分类号 |
H03L7/00 |
主分类号 |
H03L7/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|