| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a stock removal evaluation method for easily evaluating the stock removal of both front and back surfaces separately within a short period of time by using a wafer to be produced, thereby producing the wafer in which front and back stock removal have been adjusted, in a machining process in which a predetermined amount of a material is removed by simultaneously machining both the front and back faces of the wafer. <P>SOLUTION: The stock removal evaluation method for evaluating the stock removal of the wafer after machining in a machining process in which the predetermined amount of the material is removed by machining both the front and back faces of the wafer which has been chamfered at the outside periphery includes steps for: calculating the stock removal of the front and back faces of the wafer on the basis of the amount of a change in the width of the respective chamfer on the front and back faces of the wafer before and after machining; and evaluating the stock removal. <P>COPYRIGHT: (C)2013,JPO&INPIT |
