INSPECTION SYSTEM AND A METHOD FOR INSPECTING MULTIPLE WAFERS

摘要

A method and an inspection system that includes: a multi wafer support device arranged to concurrently support multiple wafers; optics arranged to acquire images of the multiple wafers supported by the multi wafer support element; a mechanical stage arranged to introduce movement between the multi wafer support element and the optics; and a processor arranged to process the images acquired by the optics.