Disclosed herein is an ultrasonic sensor including: an epoxy molding part: a piezoelectric ceramic stacked on an upper portion of the epoxy molding part; a sound absorbing material contacting sides of the piezoelectric ceramic and spaced apart from an upper portion of the piezoelectric ceramic to thereby enclose the piezoelectric ceramic and absorbing vibration; a case spaced apart from sides and a lower surface of the sound absorbing material to thereby enclose the sound absorbing material and having a shape in which a bottom surface including the epoxy molding part stacked thereon protrudes upwardly; and a molding material filled on an upper surface of the sound absorbing material and between the sides and the lower surface of the sound absorbing material and the case.
申请公布号
US2013049537(A1)
申请公布日期
2013.02.28
申请号
US201113326073
申请日期
2011.12.14
申请人
KIM BOUM SEOCK;PARK EUN TAE;SAMSUNG ELECTRO-MECHANICS CO., LTD.