| 发明名称 |
SEMICONDUCTOR DEVICE INCLUDING DIFFUSION SOLDERED LAYER ON SINTERED SILVER LAYER |
| 摘要 |
A semiconductor device includes a substrate and a first sintered silver layer on the substrate. The semiconductor device includes a first semiconductor chip and a first diffusion soldered layer coupling the first semiconductor chip to the first sintered silver layer. |
| 申请公布号 |
US2013049204(A1) |
申请公布日期 |
2013.02.28 |
| 申请号 |
US201113214379 |
申请日期 |
2011.08.22 |
| 申请人 |
OESCHLER NIELS;TRUNOV KIRILL;SPECKELS ROLAND;INFINEON TECHNOLOGIES AG |
发明人 |
OESCHLER NIELS;TRUNOV KIRILL;SPECKELS ROLAND |
| 分类号 |
H01L23/498;B23K1/20;B23K31/02 |
主分类号 |
H01L23/498 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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