发明名称 |
SUBSTRATE FOR SUSPENSION, SUSPENSION, SUSPENSION WITH ELEMENT, HARD DISK DRIVE, AND METHOD FOR MANUFACTURING SUBSTRATE FOR SUSPENSION |
摘要 |
<P>PROBLEM TO BE SOLVED: To mainly provide a substrate for suspension having a via part having high adhesion to a metal support substrate. <P>SOLUTION: The substrate for suspension of this invention is provided, which has a metal support substrate, an insulating layer formed on the metal support substrate, and a wiring layer formed on the insulating layer. In the substrate for suspension, a wiring layer for via connection and the metal support substrate are electrically connected by a via part, a recessed part composed of a bottom part and a wall part is formed in the metal support substrate, and the wall part is located at a position outside an opening part of the insulating layer in a planar view. The via part is formed so as to fill the recessed part. <P>COPYRIGHT: (C)2013,JPO&INPIT |
申请公布号 |
JP2013041633(A) |
申请公布日期 |
2013.02.28 |
申请号 |
JP20110175867 |
申请日期 |
2011.08.11 |
申请人 |
DAINIPPON PRINTING CO LTD |
发明人 |
ONUKI MASAO;KUMON SHINJI;YAMAZAKI TAKESHI;MIYAZAWA HIROAKI |
分类号 |
G11B5/60;G11B21/21 |
主分类号 |
G11B5/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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