发明名称 SUBSTRATE FOR SUSPENSION, SUSPENSION, SUSPENSION WITH ELEMENT, HARD DISK DRIVE, AND METHOD FOR MANUFACTURING SUBSTRATE FOR SUSPENSION
摘要 <P>PROBLEM TO BE SOLVED: To mainly provide a substrate for suspension having a via part having high adhesion to a metal support substrate. <P>SOLUTION: The substrate for suspension of this invention is provided, which has a metal support substrate, an insulating layer formed on the metal support substrate, and a wiring layer formed on the insulating layer. In the substrate for suspension, a wiring layer for via connection and the metal support substrate are electrically connected by a via part, a recessed part composed of a bottom part and a wall part is formed in the metal support substrate, and the wall part is located at a position outside an opening part of the insulating layer in a planar view. The via part is formed so as to fill the recessed part. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013041633(A) 申请公布日期 2013.02.28
申请号 JP20110175867 申请日期 2011.08.11
申请人 DAINIPPON PRINTING CO LTD 发明人 ONUKI MASAO;KUMON SHINJI;YAMAZAKI TAKESHI;MIYAZAWA HIROAKI
分类号 G11B5/60;G11B21/21 主分类号 G11B5/60
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