发明名称 SEALING METHOD OF PACKAGE, HOUSING OF ELECTRONIC DEVICE, AND CELL
摘要 <P>PROBLEM TO BE SOLVED: To easily seal a package while facilitating fluid circulation between the interior and the exterior of the package. <P>SOLUTION: A sealing member having a through hole is provided between a package having an opening and a lid covering the opening, and the package is joined to the lid. A cleaning liquid and a coating agent are circulated through the through hole between the interior and the exterior of the package and the sealing material is melted to seal the through hole. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013041970(A) 申请公布日期 2013.02.28
申请号 JP20110177645 申请日期 2011.08.15
申请人 SEIKO EPSON CORP 发明人 NAGASAKA KIMIO;UENO HITOSHI
分类号 H01L23/02 主分类号 H01L23/02
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