SEMICONDUCTOR DEVICE TESTING SYSTEM

摘要

PURPOSE: A semiconductor package test system is provided to solve contact stability problems that can occur later on through secured data. CONSTITUTION: A structure of a semiconductor package test system comprises a package pressing part(100), a socket housing(300), a socket guide(200), and a stress sensing part(400). The socket guide is located at a lower part of the package pressing part and comprises a socket housing accommodation space in the center. The socket housing is accommodated in the socket housing accommodation space and comprises a socket that has a contactor. The stress sensing part is in contact with a bottom surface of the socket housing.