SEMICONDUCTOR DEVICES, PACKAGE SUBSTRATES, SEMICONDUCTOR PACKAGES, PACKAGE STACK STRUCTURES, AND ELECTRONIC SYSTEMS HAVING FUNCTIONALLY ASYMMETRIC CONDUCTIVE ELEMENTS

摘要

PURPOSE: A semiconductor device including functionally asymmetrical conductive elements, a package substrate, a semiconductor package, a package laminate structure, and an electronic system are provided to simplify signal routes of metal layers in a package substrate level by including a metal core layer or the asymmetrical conductive elements. CONSTITUTION: A top package(900c) includes top semiconductor devices(951,952) on a top package substrate. A bottom package(605c) includes a bottom package substrate and a bottom semiconductor device and is connected to a top package through a plurality of interpackage connection parts. Interpackage connection parts(990A) transmit a data signal of the top semiconductor devices, reference voltages for a data circuit, and address/control signals. Interpackage connection parts(990B) with a second property transmit reference voltages or supply voltages for an address/control circuit.