| 摘要 |
PURPOSE: A chip package and a manufacturing method thereof are provided to improve reliability by precisely forming a solder ball between an insulating film and a circuit pattern layer. CONSTITUTION: An insulating film(210) is formed across a via hole. A circuit pattern layer(220) includes a recessed part(222). The recessed part is formed by pressing the via hole. A chip is boned on the circuit pattern layer. The chip is electrically connected to the circuit pattern layer. |
