| 摘要 |
PURPOSE: A heat radiation substrate and a manufacturing method thereof are provided to effectively remove heat generated from a chip by conducting the heat through an oxide layer having high thermal conductivity. CONSTITUTION: An oxide layer(102) is formed on one side or both sides of a metal plate(101). An insulating layer(103) is formed on the oxide layer. A circuit layer(104) is formed on the insulating layer. The circuit layer includes a connection pad and a circuit pattern. The insulating layer and the circuit layer have an opening(107) for mounting a chip. |
