| 发明名称 |
Circuit carrier and semiconductor package using the same |
| 摘要 |
A circuit carrier suitable for being connected with a bump is provided. The circuit carrier includes a substrate and at least one bonding pad. The substrate has a bonding pad disposed on a surface thereof for being connected with the bump. A brown-oxide layer is disposed on a surface of the bonding pad.
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| 申请公布号 |
US8384204(B2) |
申请公布日期 |
2013.02.26 |
| 申请号 |
US20100683613 |
申请日期 |
2010.01.07 |
| 申请人 |
ADVANCED SEMICONDUCTOR ENGINEERING, INC.;LIU CHIEN;CHUNG CHIH-MING |
发明人 |
LIU CHIEN;CHUNG CHIH-MING |
| 分类号 |
H01L23/482;H05K1/09 |
主分类号 |
H01L23/482 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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