| 摘要 |
<p>The invention relates to a plunger for feeding encapsulating material to a mould cavity, comprising at least one peripheral groove recessed into the cylinder casing of the plunger whereby a material part is placed in the groove which only partly fills the groove. The invention also related to a device for encapsulating electronic components mounted on a carrier. In addition, the invention also relates to a method for sealing a fitting of a plunger housing, which plunger is adapted to feed encapsulating material under pressure to a mould cavity.</p> |
