发明名称 Simulated building material - using colourless epoxy resin cladding with embedded monomeric decoarive non-woven material
摘要 <p>A plastics bonded board (12), such a chip board has a simulated building material appearance with architetural-type decoration. The board is clad with a clourless polymer coating (14) in which is embedded a nonwoven fleece (16) treated to give the impression of wood or natural stone such as marble. The board is produced with little shrinkage which improves its shear strength and is strong enough to withstand pressures of up to 1000 kg/cm2 with a 5mm thick cladding of the colourless polymer. The cladding is of epoxy resin, polyester or polyurethane and the fleece is of cellulose.</p>
申请公布号 DE2056380(A1) 申请公布日期 1972.05.25
申请号 DE19702056380 申请日期 1970.11.17
申请人 PHARMUS CHEMISCH FABRIK 发明人
分类号 (IPC1-7):29D3/02 主分类号 (IPC1-7):29D3/02
代理机构 代理人
主权项
地址
您可能感兴趣的专利