| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent the degradation of a mounting material for bonding a semiconductor light-emitting element chip. <P>SOLUTION: A semiconductor light-emitting device includes a sapphire substrate, an active region, and a light-blocking layer. The active region is provided on the sapphire substrate and has a light-emitting layer that emits light in the thickness direction of the sapphire substrate by energization. The light-blocking layer is provided on the rear surface of the sapphire substrate, blocks transmission of the light generated in the light-emitting layer to the rear surface side of the sapphire substrate, and is formed by modifying the sapphire substrate into an aluminum oxide (Al<SB POS="POST">x</SB>O<SB POS="POST">y</SB>). <P>COPYRIGHT: (C)2013,JPO&INPIT |
