| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of an electronic apparatus and the electronic apparatus which control the thickness of solder while ensuring the insulation quality. <P>SOLUTION: In a manufacturing method of an electronic apparatus 1, a substrate 7 is disposed on the metal plate 9 through solder 5, 11 and electronic components 3, 7 are disposed on the substrate through the solder 5. Then, the solder 5, 11 is reflow heated and soldering is conducted. Spacers 21, 22, which are made of an insulative resin and melt and closely contact with the solder during reflow heating, are respectively disposed at outer peripheries of the solder 5, 11. After the reflow heating, the electronic component 3 and the substrate 7 are resin sealed by a sealing resin 15. <P>COPYRIGHT: (C)2013,JPO&INPIT |
