WAVELENGTH CONVERSION CHIP FOR A LIGHT EMITTING DIODE, AND METHOD FOR MANUFACTURING SAME

摘要

According to one aspect of the present invention, provided are a wavelength conversion chip for a light emitting diode (LED), and a method for manufacturing same, wherein the method comprises the steps of: attaching a plurality of LED chips to a chip arrangement area on a top surface of a temporary support plate so that a surface on which at least one electrode is formed faces an upper portion; forming a conductive bump on each of the electrodes of the LED chips; forming a resin package part containing a fluorescent substance on the chip arrangement area to cover the conductive bump; polishing the resin package part containing the fluorescent substance to expose the conductive bump on a top surface of the fluorescent substance-containing resin package part; cutting the resin package part containing the fluorescent substance between the LED chips to form the wavelength conversion chip for the LED (here, a wavelength conversion layer obtained from the resin package part containing the fluorescent substance is formed on side and top surfaces of the wavelength conversion chip for the LED); and removing the temporary support plate from the wavelength conversion chip for the LED.