| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a fluorescent lamp type LED lamp capable of improving heat dissipating efficiency of an LED chip. <P>SOLUTION: When each LED chip 7C of a plurality of LED packages 7 mounted on a package board 5 is lighted up, heat generated by that lighting-up is efficiently transmitted and dissipated to a heat dissipation cover member 4 through a thermal via 5A of the package board 5 from each LED package 7. As a result, high temperature of each LED chip 7C is suppressed and the lifetime is prolonged. <P>COPYRIGHT: (C)2013,JPO&INPIT |
