| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a resin composition for printed circuit boards, excellent in adhesiveness to conductive layers formed by plating in spite of small surface unevennesses, heat resistance, moisture heat resistance and combustion resistance, and suitable for forming fine circuits. <P>SOLUTION: The resin composition includes an aralkyl type epoxy resin (A), an aralkyl type phenolic resin (B), boehmite (C), silicone powder (D) and polyvinyl acetal (E). <P>COPYRIGHT: (C)2013,JPO&INPIT |
