| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an apparatus and method which allows a single-sided wet chemical treatment of flat objects such as silicon substrates while exhausting developing reaction gases, while sidestepping an issue of undesired wetting of the top side due to bursting gas bubbles, without the need for protection of this side. <P>SOLUTION: A collection chamber (10) provides an inlet opening (11) in a region of an exit (9) and an outlet opening (12) in a region of an entry (8), thereby forming an exhaust air channel (13), in such a manner that a transport gas (G) can flow through the exhaust air channel (13) contrary to the transport direction (7) as well as essentially parallel to the transport plane (6) and to the transport direction (7). <P>COPYRIGHT: (C)2013,JPO&INPIT |
