发明名称 TEST CIRCUIT, INTEGRATED CIRCUIT, AND LAYOUT METHOD OF TEST CIRCUIT
摘要 <P>PROBLEM TO BE SOLVED: To provide a test circuit which can be manufactured by a further simple designing method. <P>SOLUTION: A test circuit 100 is provided with a substrate, and a wiring portion and a tested device portion 10 formed on the substrate. In the test circuit 100, an extending direction of a straight line L1 connecting a rotation center position O in a pattern forming surface of a tested device body and a plurality of connection electrodes 13a-13d is tilted by a predetermined angle to an extending direction of a wiring 21. Furthermore, the plurality of the connection electrodes 13a-13d is disposed at a position keeping the connection between the plurality of the connection electrodes 13a-13d and a plurality of wirings 21-24 even when the tested device body and the plurality of the connection electrodes 13a-13d are rotated by 90 degrees within the pattern forming surface. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013038380(A) 申请公布日期 2013.02.21
申请号 JP20120043216 申请日期 2012.02.29
申请人 SONY CORP 发明人 OGAWA KAZUHISA
分类号 H01L21/66;H01L21/3205;H01L21/768;H01L21/82;H01L21/822;H01L23/522;H01L27/04 主分类号 H01L21/66
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