发明名称 |
RESIN COMPOSITION, PREPREG, AND LAMINATED SHEET |
摘要 |
There is provided a resin composition that, despite the fact that the content of an inorganic filler is on approximately the same level as that of the conventional resins, can provide a cured resin product that has a low coefficient of thermal expansion in a plane direction and possesses excellent heat resistance and flame retardance. The resin composition comprises an epoxy resin (A), a maleimide compound (B), a curing agent (C), and an inorganic filler (D), the epoxy resin (A) being represented by formula (I):
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申请公布号 |
US2013045650(A1) |
申请公布日期 |
2013.02.21 |
申请号 |
US201113581926 |
申请日期 |
2011.03.01 |
申请人 |
MITSUBISHI GAS CHEMICAL COMPANY, INC.;OGASHIWA TAKAAKI;TAKAHASHI HIROSHI;MIYAHIRA TETSURO;UENO MASAYOSHI;KATO YOSHIHIRO |
发明人 |
OGASHIWA TAKAAKI;TAKAHASHI HIROSHI;MIYAHIRA TETSURO;UENO MASAYOSHI;KATO YOSHIHIRO |
分类号 |
C09D163/00;B32B15/092;B32B27/12;C09D165/00;C09D171/10 |
主分类号 |
C09D163/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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