| 摘要 |
PURPOSE: A monitoring pad and a semiconductor device including the same are provided to solve the routing problem of a PCB (Printed Circuit Board) by using a power pad after a package process is performed on the monitoring pad. CONSTITUTION: A monitoring pad includes a first pad(MP1) and a second pad(MP2). The first pad is electrically connected to a power pad through a conductive line. The second pad is electrically connected to an internal circuit(110) and tests the electrical property of the internal circuit. In a package process, the second pad is electrically separated from the internal circuit and electrically connected to the first pad. |
