SUBSTRATE FOR MOUNTING MULTI-CHIP AND LIGHT EMITTING DEVICE PACKAGE USING THE SAME

摘要

PURPOSE: A substrate for mounting a multi-chip and a light emitting device package using the same are provided to improve the reliability of junction by increasing the junction area between a fluorescent mold and a substrate. CONSTITUTION: A multichip mounting substrate includes a chip mounting region and a groove pattern. A groove pattern is formed in a boundary area between multiple chip mounting regions. Multiple light emitting devices(150) are mounted on the multiple chip mounting regions. A fluorescent mold is formed on the multiple light emitting devices.