METHOD OF FABRICATING ORGANIC LIGHT EMITTING DIODES

摘要

PURPOSE: A method for manufacturing an organic light emitting device is provided to improve process efficiency and reduce manufacturing costs by selectively removing a passivation layer through a dry etching process and removing a deposition mask. CONSTITUTION: A first substrate(103) including a display part(AA) and a non-display part(NA) is prepared. A driving thin film transistor, an organic light emitting diode, and a pad electrode are formed on the first substrate. An inorganic thin film layer(120a) is formed on the first substrate. An encapsulation substrate(102) is attached to the upper side of the inorganic thin film layer to correspond to the display part. An etch stop layer(140) is coated in the outside of the encapsulation substrate. [Reference numerals] (AA) Dry etching