发明名称 PLASMA GENERATING UNIT, AND APPARATUS FOR TREATING SUBSTRATE USING PLASMA
摘要 PURPOSE: A plasma generating unit and a plasma processing apparatus are provided to minimize the vortex of gas by nearly inducing gas flow near a plasma source. CONSTITUTION: A plasma processing apparatus(30) includes a processing chamber(100) and a plasma generation unit(200). The processing chamber processes a substrate using plasma. The plasma generation unit generates the plasma used for processing the substrate. The plasma generation unit provides the plasma to the processing chamber in a downstream mode. The processing chamber comprises a processing chamber(120), a substrate support member(140), a lead(160), and a baffle(180). The substrate support member is arranged in a process space of the processing chamber. The substrate support member comprises a spin chuck(142) and a driving shaft(144). The baffle is combined with an opened top of the processing chamber in order to face the spin chuck.
申请公布号 KR101234595(B1) 申请公布日期 2013.02.19
申请号 KR20110013697 申请日期 2011.02.16
申请人 发明人
分类号 H05H1/24;H05H1/46 主分类号 H05H1/24
代理机构 代理人
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