发明名称 METHOD OF MANUFACTURING SUBSTRATE FOR LED MODULE AND SUBSTRATE FOR LED MODULE MANUFACTURED BY THE SAME
摘要 PURPOSE: A method for manufacturing a substrate for an LED module and the substrate for the LED module manufactured by the same are provided to reduce lead time by omitting a mirror process. CONSTITUTION: A metal layer(11) is formed on both sides of a base material(10). A circuit pattern is formed on the metal layer. A solder resist layer(12) is coated on the circuit pattern. The base material is divided into an upper part and a lower part. The base substrate is bonded to each separated base material.
申请公布号 KR101234933(B1) 申请公布日期 2013.02.19
申请号 KR20120031796 申请日期 2012.03.28
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 LEE, YANG JE;HEO, CHEOL HO;YANG, DEK GIN;LIM, KYOUNG HWAN
分类号 H01L33/48 主分类号 H01L33/48
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