发明名称 METHOD AND APPARATUS FOR REPAIRING HIGH CAPACITY/HIGH BANDWIDTH MEMORY DEVICES
摘要 <p>Memory systems, systems and methods are disclosed that may include a plurality of stacked memory device dice and a logic die connected to each other by through silicon vias. One such logic die includes an error code generator that generates error checking codes corresponding to write data. The error checking codes are stored in the memory device dice and are subsequently compared to error checking codes generated from data subsequently read from the memory device dice. In the event the codes do not match, an error signal can be generated. The logic die may contain a controller that records the address from which the data was read. The controller or memory access device may redirect accesses to the memory device dice at the recorded addresses. The controller can also examine addresses or data resulting in the error signals being generated to identify faults in the through silicon vias.</p>
申请公布号 KR101234444(B1) 申请公布日期 2013.02.18
申请号 KR20117002786 申请日期 2009.06.10
申请人 发明人
分类号 G11C29/00 主分类号 G11C29/00
代理机构 代理人
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