| 发明名称 |
EPOXY RESIN COMPOSITION FOR CIRCUIT BOARD, PREPREG, LAMINATE, RESIN SHEET, LAMINATED BASE MATERIAL FOR PRINTED WIRING BOARD, PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE |
| 摘要 |
Provided is an epoxy resin composition for a circuit board including an epoxy resin (A); an inorganic filler (B); and a cyclic or cage-shape siloxane compound (C) having at least two Si—H bonds or two Si—OH bonds.
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| 申请公布号 |
US2013037310(A1) |
申请公布日期 |
2013.02.14 |
| 申请号 |
US201113642944 |
申请日期 |
2011.05.02 |
| 申请人 |
SUMITOMO BAKELITE CO., LTD.;KIMURA MICHIO;TANAKA NOBUKI;ENDO TADASUKE |
发明人 |
KIMURA MICHIO;TANAKA NOBUKI;ENDO TADASUKE |
| 分类号 |
C08L63/00;B32B15/092;B32B27/38;H05K1/03 |
主分类号 |
C08L63/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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