| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a through wiring board manufacturing method which can efficiently form a through wiring. <P>SOLUTION: A manufacturing method of a through wiring board 10 comprises: a process of forming a first insulation layer 2 on a first surface 1a of a substrate 1; a process of forming a conductive film 3 on the first insulation layer 2; a process of forming a first mask part on another surface 1b of the substrate 1 so as to cause a partial region of the other surface to be exposed and surround the region, and forming a second mask part in the exposed region at a distance from the first mask; a process of forming a through hole 6 from the other surface 1b to the one surface 1a to cause the first insulation layer 2 to be exposed on a bottom 6b of the through hole 6 and forming, on the bottom 6b of the through hole 6, a salient 7 composed of the substrate 1 corresponding to the second mask part; a process of forming a second insulation layer 8 on inner walls of the through hole 6 and on the other surface 1b; a process of removing the first insulation layer 2 and the second insulation layer 8 on the bottom 6b of the through hole 6 to cause the conductive film 3 to be exposed in the through hole 6; and a process of forming a through wiring 9 in the through hole 6. <P>COPYRIGHT: (C)2013,JPO&INPIT |
