发明名称 |
SEMICONDUCTOR DEVICE DIE BONDING |
摘要 |
A semiconductor device includes a semiconductor die having first and second opposing faces and an edge surface. The edge surface has an undercut under the first face. The second face of the semiconductor die is bonded to a bonding surface of a die support member, such as a thermally conductive flag of a lead frame, with a die attach material. A fillet of the bonding material is formed within the undercut. |
申请公布号 |
US2013037966(A1) |
申请公布日期 |
2013.02.14 |
申请号 |
US201213495011 |
申请日期 |
2012.06.13 |
申请人 |
FREESCALE SEMICONDUCTOR, INC;QIU SHUNAN;GONG GUOLIANG;LUO JUNHUA;XU XUESONG |
发明人 |
QIU SHUNAN;GONG GUOLIANG;LUO JUNHUA;XU XUESONG |
分类号 |
H01L23/48;H01L21/78 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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