发明名称 DICING TAPE, CUTTING METHOD AND MANUFACTURING METHOD OF ELECTRO-OPTICAL DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a cutting method capable of efficiently removing air bubbles between a dicing tape and a substrate by forming a relatively small number of holes, and further to provide a manufacturing method of an electro-optical device and a dicing tape. <P>SOLUTION: By moving a roller 51 while pressing a dicing tape 60 against the roller 51, a large panel 300 and the dicing tape 60 are bonded to each other. Here, a plurality of holes 65 is radially disposed on the dicing tape 60. More specifically, on the dicing tape 60, the holes 65 is arranged on each of a plurality of virtual radial lines r. Consequently, air bubbles that enter between the dicing tape 60 and the large panel 300 are removed through the holes 65 of the dicing tape 60. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013033787(A) 申请公布日期 2013.02.14
申请号 JP20110168071 申请日期 2011.08.01
申请人 SEIKO EPSON CORP 发明人 ISHIKAWA TOMOYA
分类号 H01L21/301 主分类号 H01L21/301
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