发明名称 |
TERMINAL-INTEGRATED METAL BASE PACKAGE MODULE AND TERMINAL-INTEGRATED METAL BASE PACKAGING METHOD |
摘要 |
The present invention relates to a terminal-integrated package method for a metal base package module that can effectively prevent short-circuit or breakage by not using wire bonding for connection with an external circuit. The terminal-integrated package method for the metal base package module includes: preparing a metal substrate formed with a conductive metal material; forming an oxide layer by oxidizing one side of the metal substrate to a predetermined depth; forming an insulation groove by partially eliminating the metal substrate to the oxide layer with a constant width along the circumference of the metal substrate from an opposite side of the metal substrate; forming a plurality of external connection terminals by forming a separation groove by eliminating a circumference portion of the metal substrate, disconnected with a center portion thereof by the insulation groove along the circumference with a predetermined gap; mounting or manufacturing an electronic part on the metal substrate or the oxide layer; and electrically connecting an electrode of the electronic part with the external connection terminal. |
申请公布号 |
US2013037309(A1) |
申请公布日期 |
2013.02.14 |
申请号 |
US201013060097 |
申请日期 |
2010.04.30 |
申请人 |
WAVENICS INC.;KIM KYOUNG-MIN |
发明人 |
KIM KYOUNG-MIN |
分类号 |
H05K1/05;H05K3/02;H05K3/30 |
主分类号 |
H05K1/05 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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