| 发明名称 |
ADHESIVE COMPOSITION FOR TEMPORARY FIXING |
| 摘要 |
<p>The purpose of the present invention is to provide an acrylic adhesive composition for temporary fixing, which is suitable for suppressing chipping of a silicon wafer when the silicon wafer is processed from a silicon block. This adhesive composition for temporary fixing contains (1) a monomer that has a (meth)acryloyl group, (2) a polymerization initiator, (3) a ß-diketone chelate and/or a ß-ketoester, and (4) an inorganic filler.</p> |
| 申请公布号 |
WO2013021945(A1) |
申请公布日期 |
2013.02.14 |
| 申请号 |
WO2012JP69851 |
申请日期 |
2012.08.03 |
| 申请人 |
DENKI KAGAKU KOGYO KABUSHIKI KAISHA;NAKAJIMA, GOSUKE;KANAI, TOMOYUKI;YODA, KIMIHIKO;OSHIMA, KAZUHIRO |
发明人 |
NAKAJIMA, GOSUKE;KANAI, TOMOYUKI;YODA, KIMIHIKO;OSHIMA, KAZUHIRO |
| 分类号 |
C09J4/02;B28D5/04;B28D7/04;C09J11/04;C09J11/06;H01L21/304 |
主分类号 |
C09J4/02 |
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