SEMICONDUCTOR CHIPS HAVING A DUAL-LAYERED STRUCTURE, PACKAGES HAVING THE SAME, AND METHODS OF FABRICATING THE SEMICONDUCTOR CHIPS AND THE PACKAGES

摘要

Dual-layered structural semiconductor chips are provided. The semiconductor chip includes a first semiconductor chip and a second semiconductor chip bonded to the first semiconductor chip. The first semiconductor chip includes a first substrate having a first bottom surface. The second semiconductor chip includes a second substrate having a second bottom surface. The first bottom surface directly contacts the second bottom surface. The related packages and the related methods are also provided.