发明名称 |
METHOD FOR FABRICATING RECEIVING STRUCTURE FOR CONDUCTINVE BUMP WITH HOLLOW CONFIGURATION, RECEIVING STRUCTURE FABRICATED BY THE SAME AND METHOD FOR CONNECTING CHIPS USING THE SAME |
摘要 |
PURPOSE: A method for manufacturing a conductive bump receiving structure with a hollow part, the conductive bump receiving structure, and a method for connecting chips using the same are provided to induce connection between the chips using a dot or line type conductive bump. CONSTITUTION: A photoresist layer(110) is laminated on a substrate. The photoresist layer is patterned. The photoresist layer with a trench structure(111) is formed by a patterning process. A seed layer(120) is coated on the front side of the photoresist layer with the trench structure. The coated seed layer is electroplated.
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申请公布号 |
KR101233486(B1) |
申请公布日期 |
2013.02.14 |
申请号 |
KR20110092752 |
申请日期 |
2011.09.15 |
申请人 |
KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY |
发明人 |
KIM, TAEK SOO;PARK, AH YOUNG;LEE, IN HWA |
分类号 |
H01L21/60 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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