| 发明名称 |
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE HAVING THE SAME |
| 摘要 |
A semiconductor chip includes a body part having a first surface and a second surface facing away from the first surface, and an opening passing from the first surface to the second surface of the body part.
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| 申请公布号 |
US2013037930(A1) |
申请公布日期 |
2013.02.14 |
| 申请号 |
US201113283769 |
申请日期 |
2011.10.28 |
| 申请人 |
HYNIX SEMICONDUCTOR INC.;ROH HEE RA;CHO IL HWAN;KIM JAE MIN;SEO HYUN CHUL;SEOL DONG HWAN |
发明人 |
ROH HEE RA;CHO IL HWAN;KIM JAE MIN;SEO HYUN CHUL;SEOL DONG HWAN |
| 分类号 |
H01L23/538 |
主分类号 |
H01L23/538 |
| 代理机构 |
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代理人 |
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| 主权项 |
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